Cleaning equipment

The co2 fluid cleaning equipment relies on the traditional wet cleaning technology. It only replaces the cleaning liquid with liquid carbon dioxide at the end of the traditional cleaning, and then performs supercritical drying. It inherits the advantages of the traditional wet cleaning and eliminates the fatal weakness in the final drying of wet cleaning. Supercritical carbon dioxide cleaning equipment without damage can solve many problems of the microelectronics industry cleaning process, such as etching and ashing high depth than structure after cleaning, etching, and ashing porous low dielectric material after cleaning, dry cleaning, semiconductor devices, metal particles after cleaning, etc., and the equipment of low cost, less carbon dioxide usage, and can be recycled, belongs to the green, pollution-free new semiconductor cleaning equipment.